Archive for December, 2013

Bourns Announces New ChipGuard® Automotive ESD Protectors

December 17, 2013
Bourns® CGA-MLC Series

Download Hi-res JPG of Bourns® CGA-MLC Series

Riverside, Calif., Dec 17, 2013 – Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the introduction of new ChipGuard® ESD protectors designed specifically to guard sensitive automotive electronics from the threat of electrostatic discharge (ESD) and are qualified to meet up to IEC 61000-4-2 Level 4 standards. Designated the Bourns® CGA-MLC Series of ESD protectors, these extremely fast bidirectional devices have low capacitance, minimal insertion loss and low leakage over a wide temperature range. The new devices from Bourns are available in ultra-small, industry standard 0402 and 0603 packages. The Bourns ChipGuard® MLC Series of ESD protectors are an ideal protection solution for a large range of automotive applications including antenna circuits, camera links, sensors, touchscreen interfaces, GPS systems, USB 3.0 devices and high-speed communication buses.

“Answering the needs of our automotive customers, Bourns expressly designed our new MLC Series of ESD protectors to deliver the high performance and reliability required for today’s sensitive automotive applications,” said Kurt Wattelet, Communications Division at Bourns, Inc. “Bourns continually strives to introduce products that our customers need to excel in their respective industries, and this new series of ESD protectors provides the advanced technology needed for the broad spectrum of high speed digital electronics employed in vehicles today.”

The Bourns® ChipGuard® MLC Series are fast-response protectors, designed to withstand multi-strike ESD threats, are RoHS* compliant and are fully AEC-Q200 qualified and supported.

Pricing and Availability
The Bourns® CGA-MLC Series of ESD protectors are available now. As a pricing reference, an ESD protector in a 0402 package is priced at $0.08 each in 30,000 piece quantities. For additional product information and specifications, please go to: www.bourns.com/data/global/pdfs/CGA-MLC.pdf.

About Bourns
Bourns, Inc. is a leading manufacturer and supplier of automotive sensors, circuit protection solutions, magnetic products, microelectronic modules, trimming and precision potentiometers, panel controls and encoders and resistive products. Headquartered in Riverside, CA, Bourns serves a broad range of markets, including telecommunications, automotive, consumer, non-critical life support medical, audio and various other market segments. Bourns® products are manufactured according to ISO-9000 and ISO-14001 standards under Six Sigma quality programs. Additional company and product information is available at the company’s website at www.bourns.com.

*RoHs Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.

Bourns® and the Bourns logo are trademarks or registered trademarks of Bourns, Inc. and may be used publicly only with the permission of Bourns and require proper acknowledgement. Other listed names and brands are trademarks or registered trademarks of their respective owners.

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Bourns Adds 3D, SPICE Model, S-Parameter and LTspice Design Files to Company Website

December 4, 2013

Riverside, Calif., Dec 4, 2013 – Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the addition of 3D, SPICE model, S-Parameter and LTspice files to the company’s website. Beneficial for circuit modeling and to simulate device performance, Bourns offers its 3D model files in IGS and STP formats, SPICE Model files in TXT or DOC formats, S-Parameter files in S2P formats, and LTspice files in LIB formats. Bourns has also made it easy for designers to find the new files by placing them in three locations on its homepage: on the “Data Sheet” search, from individual product pages and by clicking the “Design Files” button.

Bourns provides 3D model files on most of its product lines. SPICE model files are currently available for several Bourns® TBU® high-speed protectors (TXT), TVS diodes (DOC), and is offering S-Parameter (S2P) and LTspice (LIB) files for many of its inductor products. By supplying its SPICE files with the Bourns® component’s critical specifications, engineers can simply load them into the program, test their circuit and make an informed decision about the device in their application. Compared to taking this essential information from the data sheet, access to these new design tools allows engineers to speed prototyping and application development, thus saving consideration time and costs.

About Bourns
Bourns, Inc. is a leading manufacturer and supplier of automotive sensors, circuit protection solutions, magnetic products, microelectronic modules, trimming and precision potentiometers, panel controls and encoders and resistive products. Headquartered in Riverside, CA, Bourns serves a broad range of markets, including telecommunications, automotive, consumer, non-critical life support medical, audio and various other market segments. Bourns® products are manufactured according to ISO-9000 and ISO-14001 standards under Six Sigma quality programs. Additional company and product information is available at the company’s website at http://www.bourns.com.

Bourns® and the Bourns logo are trademarks or registered trademarks of Bourns, Inc. and may be used publicly only with the permission of Bourns and require proper acknowledgement. Other listed names and brands are trademarks or registered trademarks of their respective owners.