Archive for March, 2009

Bourns Announces freeXpansion™ Technology for its Multifuse®

March 31, 2009
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Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced that the company has developed freeXpansion™, a new technology added to the company’s entire line of Multifuse® surface mount polymer positive temperature coefficient (PTC) resettable fuses.  This new technology increases the performance of the fuse with the ability to handle higher currents and voltages, improves its resistance stability and allows for a smaller footprint.  Due to its new freeXpansion™ technology, Bourns is able to introduce one of the smallest families of PTCs on the market with a size of 0603, designated the Bourns® MF-FSMF Series.  Bourns’ Multifuse surface mount devices manufactured using the freeXpansion™ process is designed to meet next-generation electronics smaller size and high current requirements.  Bourns® Multifuse® devices are an optimal overcurrent circuit protection solution for broad range of equipment including products with USB 2.0, USB 3.0 and HDMI ports and in consumer electronics and automotive electronics applications.

Polymer PTC resettable fuses expand when an overcurrent event occurs and contracts when they reset.  The freeXpansion™ technology allows the device to freely expand and contract without mechanical restrictions for more stable performance, extended product life and to be manufactured in a smaller size.

“Bourns® Multifuse® products with freeXpansion™ offer distinct competitive advantages for our customers enabling reliable circuit protection across a broader range of applications,” said Brian Ahearne, technical marketing manager for Bourns’® Multifuse® products.  “As more and more electronic products become portable with design space constraints, Bourns® Multifuse® devices match application requirements for a smaller package and the ability to handle higher currents and voltages helping our OEM customers protect their valuable circuits from overcurrent conditions.”

Bourns® Multifuse® devices act as critical circuit protection components by limiting dangerous current surges, such as short circuits in electrical equipment.  These devices provide secure protection as they react to an overcurrent event by changing from a very low resistive state to a very high resistive state.  This is also referred to as the positive temperature coefficient effect or PTC effect.  Once the overcurrent surge has passed, the Multifuse® device automatically resets to its low resistive state and allows the equipment to resume operation.

What’s Next in the New World of Bourns?

March 23, 2009

Bourns Transient Blocking Units (TBU™)

Check out our latest New World campaign at www.edn.com and www.electronicdesign.com.

The acquisition of Fultec provided Bourns with a revolutionary new circuit protection product. The new product is the first “new technology” device released in over a decade.

The Transient Blocking Unit (TBU™) Electronic Current Limiter blocks transients including those from lightning, power induction, power cross, Earth Potential Rise (EPR) or other energy surge conditions. Our latest white paper addresses specific overcurrent and overvoltage faults, and demonstrates how TBU devices can provide an optimal application solution for circuit protection against these events.

If you missed the campaign kick-off, you may visit our TBU campaign landing page or simply download the TBU white paper here.

Bourns Circuit Protection Products Selected as EDN Innovation Award Finalist

March 11, 2009

Riverside, Calif., Feb 25, 2009 Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced that the company’s breakthrough Transient Blocking Unit (TBU™) circuit protection devices have been selected from hundreds of nominations to be a finalist for this year’s EDN Innovation Awards.  Instituted in 1990, the Innovation Awards honor the people, products, and technologies that have shaped the semiconductor industry over the past year. Bourns’ TBU products are technology finalists in the Power Semiconductor category. As the first new approach to electronics circuit protection in over a decade, Bourns’ new TBU technology is designed to block a transient through a current disconnecting mechanism rather than diverting or shunting the surge to ground. This blocking technology virtually eliminates latency in the circuit protection design which results in advanced surge protection for sensitive electronic equipment within nanoseconds.

“We are thrilled that our TBU products have been singled out by EDN as innovative and enabling for our customers,” said Dr. Erik Meijer, vice president of circuit protection at Bourns. “TBU technology delivers a completely new way of protecting sensitive electronic circuits from surges and other harmful events, and we are extremely honored to have a Bourns product line distinguished in this manner.”

The selection criteria for the EDN Innovation Awards competition included the following:  nominees must have demonstrated innovation that resulted in a significant advance in technology and/or product development during the past 12 months. Nominees within the Innovations of the Year Power Semiconductors category must have shipped in volume in the 2008 calendar year.

“We have our broadest set of categories in the history of our Innovation awards program in 2008,” said Rick Nelson, editor-in-chief of EDN Magazine. “With specialization affecting everything from components to test equipment, our staff diligently worked to group like technologies for meaningful comparison and delivered an outstanding slate of finalists. The slate includes the range of ICs from analog to processors, development and EDA software, amazing sensors, and modular and system products, including test equipment. The voters will face tough decisions, but without doubt, compelling products will emerge as winners.”

EDN’s worldwide audience of electronic engineers and engineering managers will use an online ballot to select the ultimate winners from among the finalists. EDN’s editorial staff and Editorial Advisory Board also take part in determining the final winners. Please visit http://www.EDN.com/innovation19 to review each of the nominees. Winners will be announced at a dinner and awards ceremony on March 30, 2009, in San Jose, CA.

About EDN and EDN.com
EDN serves the vital information needs of design engineers and engineering managers worldwide. EDN.com delivers a three-dimensional view of the electronic industry via news coverage, strategic business information, and in-depth technical content. (www.edn.com). EDN is published by Reed Business Information (www.reedbusiness.com/us), the largest business-to-business publisher in the U.S. and a member of the Reed Elsevier Group Plc (NYSE: RUK and ENL) – a world-leading publisher and information provider.